23rd annual meeting of the socity of packaging science & technology, Japan

23rd Annual meeting for packaging will hold 3rd to 4th on July 2014 in Tokyo university, Japan.
http://www.spstj.jp/english/index.html

There are some kinds of section, package material, transport packaging and package design, safety, environment, etc. 
The number of presentation is about 50 titles in 2 days.

Packaging engineers, researchers in Japan are gather to this meeting.
Usually, they are almost Japanese in around 200 people.

If you interested in this meeting, please try to attend it.
I am going to join it and has oral presentation, useful method in drop test for protective package design.
I am also connected with the other presentation that the simply measurement method on distribution environment, in poster.

K.Kawaguchi